PCB 'Smart' Manufacturing_ShenZhen Ace Golden Electronics Technology Co., Ltd

PCB "Smart" Manufacturing Overview

Trusted by 1,500+ clients for PCB manufacturing and one-stop services, Ace Golden empowers enterprises to accelerate growth.

Ace Golden specializes in the design, development, and manufacturing of double-sided and multi-layer PCBs, with products exported to South Korea, Europe, the Americas, and beyond. We hold a comprehensive suite of quality certifications to ensure compliance and reliability:ISO 9001, IATF 16949, ISO 13485, and QC 080000.

>>> Multi-layer PCB manufacturing
>>> 2-48 layers for prototypes; 2-36 layers for mass production;
>>> Support for standard PCBs, HDI boards, FPCs (Flexible PCBs), rigid-flex PCBs, and metal-core PCBs;
>>> Seamless integration of design and production workflows；
>>> TPS Quality Control System for consistent quality；
>>> Fast, on-time delivery commitments.

PCB Manufacturing Services

1500+users choose Ace Golden, PCBA processing, one-stop service, Gaode Electronics helps enterprises develop rapidly

PCB Prototyping
Fast turnaround: 1-2 days for urgent prototyping; 2-10 days for standard orders (faster than industry averages),50% discount on expedited prototyping fees
PCB Small-Batch Production
70-minute vertical jet printing,Surface copper thickness exceeding industry standards,Laser-marked characters for superior clarity,Complimentary testing included.
High-Precision PCBs
Minimum line width & spacing: 2/2 mil,Minimum via hole: 6 mil,Minimum board thickness: 0.2 mm; Maximum board thickness: 5 mm,Aspect ratio: 15:1
FPC & Rigid-Flex PCBs
Ace Golden now offers processing services for FPC (Flexible PCBs) and rigid-flex PCBs. For detailed specifications, please contact our customer support team.

Process Parameters

	Specification	Prototype
Number Of Layers	2-48 L	2-36 L
Board Thickness	0.2-17.5mm	0.2-10mm
Minimum Mechanical Aperture	0.15mm	0.15mm
Minimum Laser Aperture	3mil	4mil
HDI Type	1+n+1,2+n+2,······, Anylayer (Any layer interconnection)	1+n+1,2+n+2,······, Anylayer (Any layer interconnection)
Minimum Line Width&Spacing	2/2mil	3/3mil
Impedance Control	+/-5%	+/-10%
Maximum Copper Thickness	12oz	6oz
Maximum Plate Thickness Aperture Ratio	18:1	16:1
Maximum Board Size	650mm X 1130mm	610mm X 1100mm
Board Material	FR4/Hi-Tg/Rogers/Halogen Free/ RCC/PTFE/Nelco/Mixed Pressure Material
Surface Treatment	HASL、HASL PB FREE Immersion Gold/Tin/Silver Gold Finger Plating OSP、Immersion Gold + OSP
Special Processes	Buried/blind holes, step grooves, metal substrates, buried resistors, buried capacitors, mixed voltage, rigid-flex bonding, back drilling, step gold fingers, etc.

Production Cycle

Number Of Layers	Mass Production	Prototype	Urgent Order
2 layers	9 days	5 days	48 Hours
4 layers	10 days	5 days	3 days
6 layers	12 days	6 days	3 days
8 layers	12 days	7 days	4 days
10 layers	14 days	10 days	4 days
12 layers	16 days	10 days	5 days
14 layers	18 days	12 days	6 days
16 layers	18 days	12 days	6 days
18 layers	20 days	14 days	6 days
20 layers	20 days	14 days	10 days
22 layers	22 days	14 days	10 days
24 layers	24 days	14 days	10 days
26 layers	26 days	14 days	10 days
28 layers	28 days	14 days	10 days
30 layers	30 days	14 days	10 days
32 layers	32 days	14 days	10 days