SMT and DIP Manufacturing_ShenZhen Ace Golden Electronics Technology Co., Ltd

Manufacturing Introduction

We operate 6 dual-track placement lines equipped with imported Yamaha YSM20 and Samsung placement machines, fully automatic solder paste printers, AOI (Automatic Optical Inspection), X-Ray, and SPI (Solder Paste Inspection), along with other state-of-the-art equipment. We boast a daily mounting capacity of 3 million solder joints, with specialized expertise in high-precision and complex single-board assembly—and a proven track record in manufacturing ultra-complex single boards exceeding 10,000 solder joints.

SMT Lines	6 Double Track Automatic Lines
SMT Daily Capacity	3,000,000 Solder Joints
DIP Lines	2 Semi-Automatic Lines
DIP Daily Capacity	200,000 Solder Joints
Test Lines	2 Semi-Automatic Lines
Solder Paste Thickness Detection	2D + 3D SPI
AOI Inspection	2D + 3D AOI
Defect Rate	0.3% for Resistors/Capacitors
Defect Rate	Zero IC Component Loss
Conformal Coating Thickness	3-15μm

Mountable Component Specifications	Minimum Component Package	1005
	Minimum Component Accuracy	±0.04mm
	Pin/BGA Pitch	Chip/0.35 Pitch BGA
	IC SMT Placement Accuracy	±0.04mm
	Maximum Component Weight	150g
	Maximum Component Size	150mm*150mm
	Maximum Component Height	25mm
Compatible PCB Specifications	PCB Size	5050mm - 650500mm
Compatible PCB Specifications	PCB Thickness	0.3-6.5mm
PCB Types	Splicing Board/Veneer	POP/Regular Board/FPC/Rigid Flex Bonding Board/Metal Substrate

SMT Core Advantages

Reliability & Stability

10+ years of dedicated experience in SMT/DIP manufacturing, with a full-fledged equipment portfolio to meet the surface mount needs of diverse industries—ensuring consistent quality and performance.

Precision & Cost-Efficiency

As a high-efficiency SMT processing partner, we support components as small as 01005 and can handle QFN, BGA, and other fine-pitch components with a minimum pitch of 0.15mm. Our balanced precision and cost structure deliver exceptional value.

Proven Expertise & On-Time Delivery

Partnered with 1,500+ domestic and international enterprises, we bring rich project experience, reliable lead times, and fast turnaround—3-5 days for orders with complete materials.

Comprehensive 24/7 Support

Our customer service team is available around the clock to respond to and resolve your SMT/DIP processing inquiries promptly, ensuring a seamless collaboration experience.

Process Parameters

	Specification	Prototype
Number Of Layers	2-48 L	2-36 L
Board Thickness	0.2-17.5mm	0.2-10mm
Minimum Mechanical Aperture	0.15mm	0.15mm
Minimum Laser Aperture	3mil	4mil
HDI Type	1+n+1,2+n+2,······, Anylayer (Any layer interconnection)	1+n+1,2+n+2,······, Anylayer (Any layer interconnection)
Minimum Line Width&Spacing	2/2mil	3/3mil
Impedance Control	+/-5%	+/-10%
Maximum Copper Thickness	12oz	6oz
Maximum Plate Thickness Aperture Ratio	18:1	16:1
Maximum Board Size	650mm X 1130mm	610mm X 1100mm
Board Material	FR4/Hi-Tg/Rogers/Halogen Free/ RCC/PTFE/Nelco/Mixed Pressure Material
Surface Treatment	HASL、HASL PB FREE Immersion Gold/Tin/Silver Gold Finger Plating OSP、Immersion Gold + OSP
Special Processes	Buried/blind holes, step grooves, metal substrates, buried resistors, buried capacitors, mixed voltage, rigid-flex bonding, back drilling, step gold fingers, etc.

Production Cycle

Number Of Layers	Mass Production	Prototype	Urgent Order
2 layers	9 days	5 days	48 Hours
4 layers	10 days	5 days	3 days
6 layers	12 days	6 days	3 days
8 layers	12 days	7 days	4 days
10 layers	14 days	10 days	4 days
12 layers	16 days	10 days	5 days
14 layers	18 days	12 days	6 days
16 layers	18 days	12 days	6 days
18 layers	20 days	14 days	6 days
20 layers	20 days	14 days	10 days
22 layers	22 days	14 days	10 days
24 layers	24 days	14 days	10 days
26 layers	26 days	14 days	10 days
28 layers	28 days	14 days	10 days
30 layers	30 days	14 days	10 days
32 layers	32 days	14 days	10 days