How to control feeding errors in SMT surface mount processing? The continuous innovation in the electronics industry challenges suppliers at all levels to manufacture devices with increasingly powerful capabilities in terms of size and performance. In this case, the gap between the design and development of circuit boards and actual production tends to increase, especially because designers usually do not have first-hand experience related to production. For this reason, it is crucial to identify potential errors as soon as possible during the PCBA sampling stage, especially in the SMT patch process.

When we face the challenges of new technologies, Gaode's front-end and back-end teams do not do what they should do step by step. We proactively decided to search for the assault point. Upgrade equipment, introduce training, and enhance comprehensive capabilities from both equipment and technology perspectives. We have collaborated with Yunji Intelligent Manufacturing to introduce Industry 4.0 management systems and tools into the production line and implement intelligent manufacturing.

Now, in addition to the comprehensive upgrade of traditional AOI and SPI equipment, we have also added SMT loading and error prevention equipment, such as 3DSPI, 3DAoi, X-ray, selective wave soldering, etc. Especially with this error prevention system, we will use it to reduce quality issues caused by human errors.

Key steps for operating the SMT chip processing anti mistake material system:

This system can replace most manual SMT loading and inspection operations to prevent errors caused by manual labor, such as:

1. The system can import the SMT machine workstation table with one click, automatically compare the system BOM, identify errors in the material list, insufficient actual quantity, and incorrect material tray preparation;

2. Wrong placement of material trays, incorrect order of material trays, etc;

3. When loading and unloading materials, production line personnel use a scanning gun to scan the workstation number on the machine, and then scan the barcode labels on the materials. The system will automatically check if the feeding is correct. The staff's private alarm stop line replaces manual inspection;

4. The workstations confirmed by the production line scanning will prompt the measurement values on the IPQC computer, and the data measured by IPQC will be transmitted to the system through the bridge instrument, and the system will automatically judge the measurement results. The system automatically records information on the loading process, inspection process actions, spot check process, and material replacement process;

5. The system immediately alerts for detected errors and prompts for corrective measures to be implemented;

6. The information sharing of machine feeding settings, and the ability to print at any time for material preparation, feeding, and material personnel to refer to and execute, with consistent standards;

7. Prevent engineering change data from not being promptly notified to all relevant personnel;

8. Traceability of the loading process facilitates material tracking, personnel work tracking, and machine operation status tracking.

This device can not only identify potential issues during the sampling phase in advance, but also prevent the transition to mass production. Even before the SMT patch begins, quality abnormalities that may be caused by improper use of components have been eliminated. This can improve our through rate and enable customers' products to enter the market for sale as early as possible.

Our aim is to shorten the time to market for our customers' products by reducing errors in production. To increase its growth in the market and expand its customer base opportunities, promoting mutual growth among customers.