Solution_ShenZhen Ace Golden Electronics Technology Co., Ltd

Chip Platform Solutions

For over a decade, Ace Golden has been dedicated to delivering one-stop PCBA services, including PCBA design, solution development, PCBA manufacturing, and SMT assembly

RK Solution

Rockchip’s RK chip platform is built around "full-scenario technical adaptation," leveraging a multi-tiered chip portfolio to deliver an integrated "chip + algorithm + hardware design" solution across automotive electronics, machine vision, industrial applications, consumer electronics, and other key sectors. Deep software-hardware synergy lowers the development barrier for clients; the platform balances performance and cost to accommodate diverse budget requirements, while offering 7×12-hour tailored solution assessments. With end-to-end support from chip selection to mass production testing, we reduce project development cycles by 30% and ensure the efficiency of our clients' mass production deployment.
• Robot Vacuum Cleaners
• RK3588
• RK3576
• RK3568
• RK3562
• RK3399Pro
• RK3399
• RK3368 / PX5
• RK3308
• RK3288
• RK3188 / PX3
• RK3128
• PX30
• Rockchip (RK) Chip Platform Solutions
• Rockchip Roadmap V1.0

MTK Solution

MediaTek (MTK) stands as a pivotal ecosystem enabler in the global semiconductor industry, upholding the core values of "boundaryless universal technology and intelligent connectivity for all." With a global mindset, MTK has strategically enhanced its chip capabilities and established robust cross-regional wireless communication networks. Its high-efficiency, low-power chip technology delivers "balanced enablement" across diverse scenarios, making intelligent technology accessible to every user. We offer an integrated "chip + algorithm + hardware" one-stop solution for multiple sectors: seamless software-hardware integration lowers development complexity and boosts efficiency by 40%, while striking a balance between performance and cost to suit diverse budgetary needs. Additionally, we provide 7×12-hour tailored solution assessment services to support your project’s unique requirements.
• Rockchip (RK) Chip Platform Solutions
• MediaTek Roadmap
• Integrated Smart Tablets

AI solution

We leverage the core strengths of chips to develop an "AI PCBA Module" defined by "zero-threshold adoption, full-scenario compatibility, and cost-effective implementation." This empowers end products to rapidly gain intelligent capabilities—no deep AI technical expertise required—allowing them to evolve from "basic traditional functions" to "smart interactive capabilities..
• Intelligent Integration・Huiqi AI - AI Module Solutions
• AI Cameras
• AI PCBAs

ALOT Solution

AIoT serves as the core driver of industrial intelligence, boasting substantial strategic value and immense growth potential. As the cornerstone of data ingestion, sensors are pivotal to bridging the divide between IoT and true intelligence.We specialize in the integrated "high-precision sensors + AI + IoT" solution: leveraging sensors to fortify data collection foundations, delivering high-quality inputs for AI, and forging an intelligent "perception-decision-execution" closed loop through AI-IoT synergy. This approach breaks through the traditional IoT industry bottleneck of inefficient sensing and delayed decision-making, empowering customers to establish AIoT technical-ecological moats and seize opportunities in industrial intelligence upgrading..
• AIoT Product Solutions
• Android Payment Terminals
• AIoT PCBAs

AloT万物互联

我们的合作对象主要以智能家居、POS系统、网络安防及交通等产品作为加工生产，以解决客户在AloT万物互联领域任何PCBA相关问题，为客户的发展提供帮助。
• 智能家电中控板
• 视频会议一体机
• POS机及数据采集终端
• 交通
• 网络安防
• POS系统
• 智能家居

新能源

我们的合作对象主要风能电力及光伏电力两大领域产品作为加工生产，以解决客户在新能源领域任何PCBA相关问题，为客户的发展提供帮助。
• 光伏电力
• 风能电力

AloT万物互联

封装载板

IC载板全称IC封装基板(IC Package Substrate)，是封装测试环节中的关键载体，用于建立IC与PCB之间的讯号连接，起到保护电路，固定线路并导散余热的作用。IC载板按材料分，大致分为BT树脂类和ABF类；如按封装方式分类，可将IC载板分为BGA封装基板、CSP封装基板、FC封装基板和MCM封装基板。

Process Parameters

	Specification	Prototype
Number Of Layers	2-48 L	2-36 L
Board Thickness	0.2-17.5mm	0.2-10mm
Minimum Mechanical Aperture	0.15mm	0.15mm
Minimum Laser Aperture	3mil	4mil
HDI Type	1+n+1,2+n+2,······, Anylayer (Any layer interconnection)	1+n+1,2+n+2,······, Anylayer (Any layer interconnection)
Minimum Line Width&Spacing	2/2mil	3/3mil
Impedance Control	+/-5%	+/-10%
Maximum Copper Thickness	12oz	6oz
Maximum Plate Thickness Aperture Ratio	18:1	16:1
Maximum Board Size	650mm X 1130mm	610mm X 1100mm
Board Material	FR4/Hi-Tg/Rogers/Halogen Free/ RCC/PTFE/Nelco/Mixed Pressure Material
Surface Treatment	HASL、HASL PB FREE Immersion Gold/Tin/Silver Gold Finger Plating OSP、Immersion Gold + OSP
Special Processes	Buried/blind holes, step grooves, metal substrates, buried resistors, buried capacitors, mixed voltage, rigid-flex bonding, back drilling, step gold fingers, etc.

Production Cycle

Number Of Layers	Mass Production	Prototype	Urgent Order
2 layers	9 days	5 days	48 Hours
4 layers	10 days	5 days	3 days
6 layers	12 days	6 days	3 days
8 layers	12 days	7 days	4 days
10 layers	14 days	10 days	4 days
12 layers	16 days	10 days	5 days
14 layers	18 days	12 days	6 days
16 layers	18 days	12 days	6 days
18 layers	20 days	14 days	6 days
20 layers	20 days	14 days	10 days
22 layers	22 days	14 days	10 days
24 layers	24 days	14 days	10 days
26 layers	26 days	14 days	10 days
28 layers	28 days	14 days	10 days
30 layers	30 days	14 days	10 days
32 layers	32 days	14 days	10 days

Note: Delivery times exclude engineering lead time (typically 2-7 days). Contact our team for customized delivery schedules.

1,500+ domestic customers (serving both domestic and international clients)

0755-29194291